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NTD5406N, STD5406N
Power MOSFET
40 V, 70 A, Single N ? Channel, DPAK
Features
? Low R DS(on)
? High Current Capability
? Low Gate Charge
? AEC ? Q101 Qualified and PPAP Capable ? STD5406N
? These Devices are Pb ? Free and are RoHS Compliant
Applications
? Electronic Brake Systems
? Electronic Power Steering
? Bridge Circuits
V (BR)DSS
40 V
http://onsemi.com
R DS(ON) TYP
8.7 m Ω @ 10 V
N ? Channel
D
I D MAX
(Note 1)
70 A
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
Symbol
V DSS
V GS
Value
40
± 20
Unit
V
V
G
S
Continuous Drain
Current ? R q JC
Power Dissipation ?
R q JC
Continuous Drain
Current ? R q JA
(Note 1)
Power Dissipation ?
R q JA (Note 1)
Steady
State
Steady
State
Steady
State
Steady
State
T C = 25 ° C
T C = 125 ° C
T C = 25 ° C
T A = 25 ° C
T A = 125 ° C
T A = 25 ° C
I D
P D
I D
P D
70
40
100
12.2
7.0
3.0
A
W
A
W
4
1 2
3
DPAK
CASE 369C
STYLE 2
1
MARKING
DIAGRAM
YWW
54
06NG
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode) Pulsed
I DM
T J ,
T STG
I S
150
? 55 to
175
63.5
A
° C
A
Y
WW
5406N
G
= Year
= Work Week
= Specific Device Code
= Pb ? Free Device
Single Pulse Drain ? to Source Avalanche
Energy ? (V DD = 50 V, V GS = 10 V, I PK = 30 A,
L = 1 mH, R G = 25 W )
EAS
450
mJ
ORDERING INFORMATION
Device Package Shipping ?
T L
Lead Temperature for Soldering Purposes 260 ° C
(1/8” from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE RATINGS (Note 1)
NTD5406NT4G DPAK 2500 / Tape & Reel
(Pb ? Free)
STD5406NT4G DPAK 2500 / Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Parameter
Junction ? to ? Case (Drain)
Junction ? to ? Ambient (Note 1)
Symbol
R θ JC
R θ JA
Max
1.5
49
Unit
° C/W
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
? Semiconductor Components Industries, LLC, 2013
August, 2013 ? Rev. 6
1
Publication Order Number:
NTD5406N/D
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